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1015464 SOLDER WIRE, LEAD FREE, 0.7MM, 500G
Κατασκευαστής: MULTICOMP
Part Number:812014

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SOLDER WIRE, LEAD FREE, 0.7MM, 500G; Flux Type:No Clean and Rosin Flux; Solder Alloy:97.1, 2.6, 0.3 Sn, Ag, Cu; External Diameter - Metric:0.7mm; External Diameter - Imperial:0.028"; Melting Temperature:217?C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (07-Jul-2017); Bit Temperature Max:370?C; Bit Temperature Min:350?C; External Diameter:0.7mm; Material Composition:Sn97.1Ag2.6Cu0.3; Standard:DIN EN 29453; Weight:500g; Wire Diameter:0.7mm



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